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INFORMATION TECHNOLOGY & DATA COMMUNICATION
Amphenol is a global provider of interconnect solutions to designers and manufacturers of Internet-enabling systems. Amphenol’s range of offerings in electrical and optical cable, cable assembly, connector products, and backplane interconnect systems span applications in PCs, servers, storage systems, optical and copper networking equipment, modems, hubs, routers, switches, media display systems, and Internet appliances. With our design creativity and cost-effectiveness, Amphenol leads the way in interconnect development for Internet equipment, infrastructure, enterprise networks, and appliances. Whether industry standard or application-specifi c designs are required, Amphenol provides customers with products that enable performance at the leading edge of next-generation high-speed technology.
AirMax VS®
The AirMax VS® connector utilizes edge-coupling technology to improve electrical impedance control with optimized stagger to minimize signal cross-talk. This innovative combination delivers a cost effective interconnect for multi-gigabits/s applications. To leap frog traditional complex Stripline designs, the AirMax VS solution utilizes "Virtual Shields" which eliminate costly metal interleaves between columns.
**AirMax VS is a registered trademark of FCI
Aptera™
The Aptera™ connector's low-profile design addresses difficult packaging challenges by balancing high-speed interconnect with the need to conserve board space and maximize airflow. Ideal for the space constraints of high-speed memory and card edge applications, Aptera's low profile construction reduces minimum slot pitch between daughtercards to 10mm (.39").
Aptera™ Stacker
Amphenol's Aptera™ Stacker provides a mezzanine solution with the same electrical performance as standard Aptera. The connector is available in 40mm board to board stack heights which mate to the standard Aptera backplane modules.
Backplane Power
Amphenol's backplane power series is designed to package high power availability in a small form factor with customized options. This new range has many unique features to meet or exceed existing competitive products in power density.
Backplane Systems
Amphenol's design and applications engineering experts apply knowledge gained from thousands of successful backplane designs to your project delivering an integrated backplane system with superior signal channel performance at an optimized cost. We routinely manufacture backplane systems with data rates up to and beyond 20 Gbps with field-proven mechanical reliability.
Backplanes & Daughter Cards
Amphenol's capabilities are among the world’s broadest and most advanced, delivering consistent quality and high-bandwidth systems and mission critical applications for more than 30-years. Proven engineering and manufacturing expertise eliminates printed circuit (flexible or rigid) design obstacles.
Battery Harness
These cables form an alarm harness in an Uninterruptible Power Supply system. The specially designed “D-sub” assemblies are tested water tight at a depth of 3 meters (10feet). This ensures reliable signal interconnect performance under the severe conditions typically encountered in outside cabinets. Individual assemblies permit substantial variation in length, configuration and form factor for completed harnesses.
BNC
Developed in the late 1940s as a miniature version of the Type C connector, BNC stands for Bayonet Neill Concelman and is named after Amphenol engineer Carl Concelman. The BNC product line is a miniature quick connect RF connector. It features two bayonet lugs on the female connector. BNCs are ideally suited for termination on miniature and subminiature coaxial cable (RG-58, 59, to RG-179, RG-316, etc.
BTB
Board-to-board connectors are available in plug-socket pairs with pin counts ranging from 8 to 50. Spring-type board-to-board connectors are robust and suitable for use in applications where vibration is common, such as application in a car audio system.
C-Byte™ Compression Connector
Amphenol has developed the patented C-Byte™ flex compression connector system, to substantially increase interconnection speed, reduce cost, and eliminate the soldering of mating connectors to circuit boards. The Amphenol C-Byte™ flex compression system combines high-signal integrity, solderless connector termination, and low cost in versatile board mating configurations.
Capacitively Decoupled BNC
Amphenol's 456 Series of RF connectors provides capacitive decoupling between the connector body and the mounting panel. EMI on the coaxial shield is shunted to the chassis ground through the capacitors, while not affecting the DC and power frequencies. This reduces ground loop problems and provides a mechanism to harmlessly dissipate ESD to chassis ground. Filtering does not affect the signal contact, but only the shell to ground connection. Capacitively decoupled RF connectors are intermateable and interchangeable with standard non filtered versions.
cLGA Socket Connector
The Amphenol cLGA® land grid array socket system brings conventional-connector-material construction to a high-performance, low-cost socket design. The cLGA® socket is fully qualified under the EIA-540BOAE and Telcordia GR-1217-CORE specifications. The cLGA product1 is available in standard .050" and 1 millimeter centerline configurations. A wide array of socket sizes and styles are available.
Crossbow™
The Crossbow™ connector system is the first differential connector truly optimized for orthogonal midplane applications. Crossbow is designed so the differential pairs on each side of the midplane share vias, allowing designers to take full advantage of the benefits associated with orthogonal midplane architectures. With 20+ Gbps performance, Crossbow meets the IEEE 802.3ap v3.2 10GBASE-KR standard with margin, ensuring compliance with future 10 Gbps specifications.
cStack
The Amphenol cLGA® land grid array socket system brings conventional-connector-material construction to a high-performance, low-cost socket design. The cLGA® socket is fully qualified under the EIA-540BOAE and Telcordia GR-1217-CORE specifications. The cLGA product1 is available in standard .050" and 1 millimeter centerline configurations. A wide array of socket sizes and styles are available.
CX4 / CX4 Active
Amphenol’s CX4 High Speed Active Assemblies are ultra-high performance, cost-effective I/O solutions for gigabit speed applications in data and switched fabric I/O, switches, routers, and computer clusters. Amphenol's Assemblies exceed CX4 standard requirements and have been qualified to perform at 5Gb or Double Data Rate (DDR) Infiniband and 10GBASE-CX4. Our active assemblies are cost effective and provide lower EMI when compared to media converters.
D-Sub
The standard and high density D-Subminiature connectors are available in five shell sizes offering a wide choice of contact positions: 9, 15, 25, 37, and 50 in standard density and 15, 26, 44, 62, and 78 positions in high density.
DisplayPort Connectors
Amphenol now creates DisplayPort connectors. DisplayPort is a new digital display interface standard put forth by the Video Electronics Standards Association (VESA). It is a next generation digital interface that is designed to replace LVDS.DVI, and eventually VGA. It covers provisions for high definition digital audio-video and graphics streaming via the interface through the same cable.
E-SATA
Amphenol's high performance external SATA has evolved from SATA that was originally designed as internal or inside-the-box interface technology. External SATA brings the same performance and features to external storage solutions such as USB 2.0 and Firewire (IEEE 1394). Available in both board- mount and cable end connectors, e-SATA cable assemblies satisfy customized requirements.
E-SATA Receptacle
Amphenol's high performance external SATA has evolved from internal or inside-the-box SATA interface technology. External SATA brings the same performance and features to external storage solutions such as USB 2.0 and Firewire (IEEE 1394).
eHSD®
Amphenol's eHSD® connector is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. eHSD is designed to support up to 10 Gbps backplane designs. eHSD is fully backwards compatible with VHDM-HSD delivering as much as 10 dB lower crosstalk. A modular design allows all the features and functionality required in a system to be integrated in a single robust connector.
EXD Skewclear Cable
The EXD (EXtended Distance) cable has been developed to improve basic attenuation in high data rate twinaxial copper cables and totally eliminate high frequency resonances (suckouts) that can severely affect harmonic signal content in these systems. Our EXD cable offers a 10-20% attenuation improvement, and resonance elimination up to 20GHz. Patent pending.
Fiber Optic Outdoor Cable Assembly
These fiber optic cable assemblies are designed to be used in cellular towers. Resistant to harsh environments, Amphenol's outdoor cable assemblies are totally immune to interference, EMI, RFI, and ESD including lightning. Cable assemblies come in 2 and 4 positions and are fully mate-able with Huber & Suhner.
Filtered Connectors
Amphenol's FCC57 series of filtered micro-ribbon connectors provides a very cost effective solution to combat EMI. The family of connectors is the telephone industry's standard for multiple line connections. Available in 36, 50, and 64 sizes with a variety of termination styles including: male/female, right angle PCB, vertical, press-fit, and solder cup.
Filtered Connectors (Filter D-Subs)
These fiber optic cable assemblies are designed to be used in cellular towers. Resistant to harsh environments, Amphenol's outdoor cable assemblies are totally immune to interference, EMI, RFI, and ESD including lightning. Cable assemblies come in 2 and 4 positions and are fully mate-able with Huber & Suhner.
Filtered Connectors (Micro Ribbon)
Amphenol's FCC57 series of filtered micro-ribbon connectors provides a very cost effective solution to combat EMI. The family of connectors is the telephone industry's standard for multiple line connections. Available in 36, 50, and 64 sizes with a variety of termination styles including: male/female, right angle PCB, vertical, press-fit, and solder cup.
GbX®
Amphenol's GbX® connector is a high-density optimized differential connector offering a choice of density configurations. GbX provides increased density, exceptional impedance matching, and low crosstalk. GbX delivers data rates of 5 Gbps and is ideal for 4 x 3.125 XAUI links. The GbX connector provides up to 69 pairs per linear inch (5-Pair configuration) with a choice of configurations (2, 3, 4, and 5-Pair) for higher application flexibility.
GbX® E-Series
Amphenol's GbX® E-Series backplane module is a highly optimized differential connector with a choice of density configurations for application flexibility. The backplane module shares the same footprint as standard GbX, providing a drop-in replacement which allows designers to easily scale existing backplane platforms up to 6.25 Gbps data rates without costly re-design.
GbX® L-Series
Building on the strength of the GbX® product family, the GbX L-Series connector provides additional flexibility with a cost-performance optimized solution. With the ability to combine GbX and GbX L-Series on the same card edge, designers can achieve specific performance needs with a mix of high- and low-speed connections. Ideal for TTL sense and control and other low-speed data lines.
GbX® Right Angle Male (RAM)
Amphenol's GbX® Right Angle Male (RAM) enables co-planar board-to-board or board to cable high-speed interconnections. Currently available in 2-Pair configurations (27 differential pairs per linear inch), with two different heights - standard RAM and extended RAM. A high-speed differential and L-Series version are also available.
GbX® U-Series
Upgrade your existing GbX backplane to enhanced electrical performance with the GbX U-Series backplane module. GbX U-Series incorporates an enhanced footprint for improved impedance and lower crosstalk and scales to data rates up to and beyond 10 Gbps. All generations of GbX daughtercard connectors are compatible with the GbX U-Series backplane modules, allowing designers to upgrade existing systems with minimal redesign.
HD-Optyx™
HD-Optyx™ is a blind-mate, fiber optic connector, designed for applications where flexibility and card edge density are paramount. The innovative modular architecture facilitates efficient layout solutions and provides a wide array of possibilities during design-ins or system upgrades. Common components may be readily configured for custom applications eliminating the need for costly tooling and lost time to market. The platform combines reliable performance with ferrule protection in one compact, robust package to minimize possible fiber contamination and damage.
HDM® / HDM® Plus
Amphenol's High Density Metric (HDM®) and High Density Metric Plus (HDM PLUS®) connector family is designed for applications that demand a combination of high signal pin density plus high-speed signal integrity. Amphenol's HDM connector family has been chosen for demanding applications in many of the high-performance servers which support the internet as well as other telecom and datacom applications.
HDM® Stacker
The HDM Stacker connector optimizes card functionality in a limited space. It can be used in parallel board packaging, mezzanine cards, parallel backplanes and bridgeboard applications. The connector is available in 72-pin and 144 pin signal modules in soldertail or press fit configurations. Stacking heights range from 15mm to 32mm.
NeXLev®
Amphenol's NeXLev® high-density parallel board connector is capable of handling data rates up to 12.5 Gbps, providing a robust solution for your increasing bandwidth demands in mezzanine applications. The connector can be routed to support single-ended or differential archiectures and offers 20 stacking heights from 10-33mm. NeXLev uniquely applies BGA attachment technology, widely accepted for its high reliability, making it robust both during manufacturing and in the field.
System Integration
Amphenol has over 10 years experience building complex systems and sub-systems. We combine unparalleled engineering with industry-leading connectors, high-technology printed circuit board and backplane assembly expertise, and systems integration services to deliver total solutions. Technology focused vertical integration means technology leadership where it matters and focused program management to speed your system to market with the highest possible quality at the lowest possible cost.
Ventura®
The Ventura® platform can deliver data at 6.25 Gbps per signal - the fastest single-ended connector available - and reach speeds of 12 Gbps when driven differentially. With a density of up to 178 pins/inch, Ventura offers the most pins per inch of any connector on the market. Utilizing surface mount technology to minimize via effects, Ventura is designed for high performance applications.
VHDM®
The VHDM® connector platform is the industry standard for high-speed backplane applications, with measured performance to 3.125 Gbps and billions of pins installed worldwide. VHDM is available in 6 and 8-Row configurations providing 76 - 101 real signals per linear inch. Stripline shielding allows 100% of the pins to be used for signals.
VHDM® H-Series
VHDM® H-Series uses an 0.018" (,045mm) PCB hole for improved routability, which can eliminate costly layers in the printed circuit board, reduce impedance discontinuities, and improve the ability to back-drill, reducing via stub effects. Additional shield-compliant pins on the daughtercard wafer improve signal integrity. VHDM H-Series is backwards compatible and can be designed into the same slot as standard VHDM, enabling data rates up to 6.25 Gbps.
VHDM® L-Series
Building on the strength of the VHDM® product family, the VHDM L-Series connector provides additional flexibility with a cost-performance optimized solution. With the ability to co-locate any combination of VHDM, VHDM-HSD™ or VHDM L-Series on the same connector, designers can achieve specific performance needs with a mix of high- and low-speed connections. Ideal for TTL sense and control and other low-speed data lines.
VHDM® Right-Angle Male
The VHDM® Right-Angle Male (VHDM® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution. 6-Row and 8-Row versions are available with 76-101 real signals per linear inch. Applications include cable I/O interfacing directly to the edge of the daughtercard, planar extender-card applications, and straight I/O into the right angle female VHDM connector. Performance up to 3.125 Gbps.
VHDM Stacker
Amphenol's VHDM Stacker allows the design of parallel board-to-board connections with the high-speed, high-density performance of standard VHDM. The connector utilizes press fit compliant pins which can be routed singled-ended or differentially. 10 and 15 column modules are available with stacking heights from 18mm and up. The VHDM Stacker delivers data rates of 3.125 Gbps with 76-101 real signals per linear inch.
VHDM-HSD™
VHDM-HSD™ connector is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. A modular design allows all the features and functionality required in a system to be integrated in a single robust connector. VHDM-HSD delivers data rates up to 5 Gbps, scalable to 10 Gbps with backwards compatible eHSD® connector. Available in 5, 6, and 8-Row versions.
XCede®
Designed for 20+ Gbps performance, Amphenol's XCede® connector platform enables the future data rate requirements of datacom, telecom, storage, and wireless equipment. Offering a linear density of 82 differential pairs per inch, the XCede product family meets the true high density needs of architectures with multiple front or rear fabric slots and blade systems with cooling straight through the backplane. XCede meets the IEEE 802.3ap v3.2 10GBASE-KR standard with margin. Available in 85 and 100 ohm impedance.
XCede® Right Angle Male
Amphenol's XCede Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional backplane components in a right-angle orientation. XCede RAM mates with standard right angle female daughtercards connectors, providing the same mechanical and electrical performance as standard XCede. Available in 85 and 100 ohm impedance.
XCede® Stacker
The XCede® Stacker enables parallel board to board designs with the same high levels of performance and reliability as the XCede backplane system. XCede Stacker is available in a 4-Pair configuration with stacking heights from 15mm to 44mm. Modular construction and guidance options allow optimized connector lengths for each application. Available in 85 and 100 ohm impedance.
XFP Cages and connectors
The interconnect system comprises a 30 position 0.8mm pitch connector and a press-fit cage designed to interface with the XFP module as detailed in INF-8077i “10 Gigabit Small Form Factor Pluggable Module.” The connector system is capable of a 10 Gigabit data rate and is intended for external connections. Various heat sink options are available.
