Molex’s Mini-Fit Sr. line is a 10.00 mm (.393") pitch connector handling up to 50.0A per circuit. This high current system is finding use in applications ranging from computer work stations to power supplies to industrial equipment.

SPECIFICATIONS

• Wire-to-Wire and Wire-to-Board
• Single Row: 2 to 6 Circuits
• Dual Row: 6 to 14 Circuits
• Tin Plating
• 50.0A max, 600V
• Crimp Termination
• Through-hole
• 8 to 16 AWG

The Sabre system is a robust power connector supplying up to 18 amperes for high current applications.The 7.50mm (.295") pitch system was designed to provide enhanced terminal position assurance to prevent terminal backout in high vibration environments.

SPECIFICATIONS

• Wire-to-Wire and Wire-to-Board
• 2 to 6 Circuits
• 18.0A, 600V
• Tin Plating
• Crimp Termination
• 14 to 18 AWG
• Through-hole
• UL1950 Finger-proof version available

Mini-Fit Jr. is a 4.20mm (.165") pitch highcurrent/high-density power connector offering great design flexibility for wire to-wire and wire-toboard housings. Current carrying capability is up to 9.0A. Mini-Fit HCS (High Current System) is capable of carrying up to 12.0A per circuit and fits into all existing Mini-Fit housing configurations. Mini-Fit RTC is designed with a high-temperature LCP housing,Mini-Fit Reflow Temperature Capable (RTC) Headers can withstand high SMT solder-reflow temperatures to guarantee compatibility with lead-free RoHS reflow processes.

SPECIFICATIONS

• Wire-to-Wire and Wire-to-Board
• 2–24 Circuit (Dual Row)
• 3–5 Circuits (Single Row)
• Up to 12A, 600V Rating
• Tin and Gold Plating
• Crimp Termination
• 16–28 AWG
• Through-hole, SMC and Press-fit

Mini-Fit BMI (Blind Mate Interface) connectors are designed for applications requiring the blind mating of modules, subassemblies or PCBs.
Mini-Fit SMC (Surface Mount Compatible) is made of material that resists high temperatures, which allows it to withstand the IR soldering processes.
Mini-Fit CPI (Compliant Pin Interface) offers a unique compliant pin design, which requires no soldering.

SPECIFICATIONS

• Wire-to-wire,wire-to-board, board-to-board versions
• Available in 4 through 24 circuit housings
• Up to 12A, 600V Rating
• Tin and Gold Plating
• Crimp Termination
• 16–28 AWG
• Through-hole, SMC and Press-fit
• UL, CSA, TÜV approved

The Micro-Fit 3.0 is a unique connector system that incorporates many of the features previously found only on large power connectors. Variations include dual row, single row and blindmate (BMI) versions.

SPECIFICATIONS

• Micro-Fit 3.0
  • Wire-to-Wire and Wire-to-Board Versions
  • Dual Row: 2 to 24 Circuits- Single Row: 2 to 12 Circuits
  • Through-hole and SMT
• Micro-Fit BMI
  • Wire-to-Wire,Wire-to-Board and Board-to-Board Versions
  • Dual Row: 4 to 24 Circuits
  • Through-hole
• Up to 5.0A, 250V Rating
• Crimp Termination
• 20 to 30 AWG
• UL 94V-0, CSA, TÜV approved

Standard .062" diameter terminals are used in 3.68mm (.145") pitch housings with a maximum rating of 5.0A.

Standard .093" diameter terminals are used in 5.03mm (.198") pitch housing with a maximum rating of 12.0A.

SPECIFICATIONS

• Standard .062":
  • Wire-to-Wire
  • 2 to 15, 24, 36 Circuits
  • 5.0A, 250V
• Standard .093":
  • Wire-to-Wire,Wire to Board
  • 2 to 15 Circuits- 12.0A, 600V
• Tin, Select Gold or Gold Plating
• Loose or Reel Packaging