1.25mm (.049") pitch Wire-to-Board micro connector system is designed for high-density harness applications.

SPECIFICATIONS

• Wire-to-Wire,Wire-to-Board, Board-In 2 to 15 Circuits, Single Row 0.8 to 1.0A, 125V
• Tin Plating
• Crimp Termination
• Through-hole, SMT
• 26 to 32 AWG

Molex’s 1.25mm (.049") pitch PanelMate series is an ultra low-profile connector system designed for tight packaging applications. The PanelMate name derives from the original flat-panel LCD display applications for which it was designed.

SPECIFICATIONS

• Wire-to-Board
• Shielded/Unshielded SMT headers
• 2 to 30 Circuits, Single Row,
• 1.0A, 125V
• Crimp Termination
• Gold Plating
• 28 to 32 AWG

The Molex 1.25mm (.049") pitch SMT CLIK-Mate wire-to-board series has a superior lock design that offers easier use and better mating retention compared to competitive versions. Providing up to 60% space savings when compared to 2.00mm pitch systems, CLIK-Mate 1.25mm was designed for applications that require higher pin count connectors to carry more signal lines in less space.

SPECIFICATIONS

• Wire-to-board up to 1A/50V
• Crimp termination
• Vertical and right-angle SMT PCB headers
• Tin-plated terminals
• Applicable wire range 26-28 AWG
• 2 to 15 circuits single row

2.00mm (.079") pitch SMT CLIK-Mate wire-to-board series provides dual positive lock for greater mating assurance and reliability. CLIK-Mate 2.00mm was designed for applications that require higher pin count connectors to carry more signal lines in less space.

SPECIFICATIONS

• Wire-to-board up to 3A, 250V
• Crimp termination
• Vertical and right-angle SMT PCB headers
• Tin-plated terminals
• Applicable wire range 22-26 AWG
• 4-14 circuits (even) single row

The 1.27mm (.050") Picoflex IDT Ribbon Cable System offers designers more options for high-density applications where standard discrete wire and flat flexible connectors are not appropriate.

SPECIFICATIONS

• 1.27mm (.050") Ribbon Cable System
• Wire-to-Board, Board-In
• 4 to 26 Circuits, Single Row
• Standard Cable Assemblies
• 1.2A, 250V
• Tin or 30μ" Gold Plating
• IDT Termination
• Through-hole, SMT
• 26 or 28 AWG Ribbon Cable

Picoflex™ 1.27mm pitch discrete wire receptacles extend the broad range of Picoflex PCB headers and IDT cable products. When compared with Picoflex IDT cable connectors, the Picoflex discrete wire receptacle offers a higher current.

SPECIFICATIONS

• Wire-to-Board up to 2.4A, 250V
• Crimp Termination
• Applicable Wire Range 24-28 AWG
• 4-26 Circuits Single Row
• Mates with all Picoflex Headers

The positive-latch system of this new Picoflex SMT Header meets customer requirements for a wire-toboard connection with a greater retention force than can be achieved with the standard Picoflex headers.The latches also make this an ideal connector for compact, wire-to-board connections in highvibration environments in the industrial and automotive markets.

SPECIFICATIONS

• Mates with Picoflex 1.27mm (.050") IDT receptacle
• 4 to 26 Circuits, Single Row
• 1.2A, 250V
• Tin or 30μ" Gold Plating
• With or without pegs
• Tube or Tape & Reel packaging

2.00mm (.079") pitch. Molex’s Milli-Grid family of high-density connectors is based on a 2.00 x 2.00mm grid pattern.

SPECIFICATIONS

• 2.00mm Grid High-Density System
• Wire-to-Wire,Wire-to-Board, Board-to-Board
• Dual Row: 4 to 50 Circuits
• 0.5 to 1.5A, 125V
• Flash, 15μ", 30μ" Gold Plating
• Crimp and IDT
• Through-hole, SMT
• 26 to 30 AWG Crimp
• 28 AWG Ribbon

2.50, 2.54, 3.96 and 5.08mm (.098, .010, .156 and .200") pitch Wire-to- Board and Board-to-Board interconnect systems.

SPECIFICATIONS

• Wire-to-Board, Board-to-Board
• Vertical and Right Angle Headers
• 2.5 to 7A, 250V
• 2 to 36 Circuits, Single Row
• Tin, 15μ" Gold, Select Gold Plating
• Crimp and IDT Termination
• Through-hole
• 18 to 30 AWG

Designed for use with discrete wire or round conductor flat cable, the Molex standard connectors lend themselves to a variety of applications.

SPECIFICATIONS

• 2.54 and 3.96mm (.100 and .156")
• IDT Wire-to-Board System
• 2.5 to 4.0A, 250V
• 2 to 24 Circuits, Single Row
• Tin, 15μ" Gold, Select Gold Plating
• IDT Termination
• Through-hole
• 18 to 28 AWG

2.54mm (.100") pitch modular system available in 3 standard platings.

SPECIFICATIONS

• Wire-to-Board, Board-to-Board
• Single Row: 2 to 32 Circuits
• Dual Row: 6 to 64 Circuits
• 3.0A, 350V
• Tin, 15μ" Gold, 30μ" Gold
• Crimp Termination
• Through-hole and SMT
• 22 to 28 AWG