SlimStack is the new family name for Molex’s broad range of Micro SMT stacking board-to-board connectors. Applications include PDAs, cellular phones, camcorders, notebook PCs and other compact equipment.

SPECIFICATIONS

• SlimStack – 0.40 mm (.016") Pitch
  » Vertical and Right Angle
  » Single and Dual Row
  » 7 to 120 Circuits
  » 0.95mm to 4.00mm Stack Heights
  » 50V, 0.3A Max
• SlimStack – 0.50 mm (.020") Pitch
  » Vertical and Right Angle
  » 16 to 140 Circuits
  » 1.50mm to 7.00mm Stack Heights
  » 50V, 0.5A Max
• SlimStack – 0.635 mm (.025") Pitch
  » Vertical Plug and Receptacles
  » 20 to 240 Circuits
  » 3.00mm to 16.00mm Stack Heights
  » 100V, 0.5A Max
• SlimStack – 1.00 mm (.0395") Pitch
  » Vertical Plugs and Receptacles
  » 20 to 140 Circuits
  » 8.00mm to 20.00mm Stack Heights
  » 100V, 0.5A Max

The SEARAY connector system was developed for low-profile applications requiring high-density and high-performance mezzanine board-toboard connectors supporting data rates up to 10GBps.

SPECIFICATIONS

• Stack height ranging from 7.0 to 11.0mm
• Circuit sizes of 114 to 400 circuits
• 1A/250VAC per contact

Mini-Fit Jr. is a 4.20mm (.165") pitch highcurrent/high-density power connector offering great design flexibility for wire to-wire and wire-toboard housings. Current carrying capability is up to 9.0A. Mini-Fit HCS (High Current System) is capable of carrying up to 12.0A per circuit and fits into all existing Mini-Fit housing configurations. Mini-Fit RTC is designed with a high-temperature LCP housing,Mini-Fit Reflow Temperature Capable (RTC) Headers can withstand high SMT solder-reflow temperatures to guarantee compatibility with lead-free RoHS reflow processes.

SPECIFICATIONS

• Wire-to-Wire and Wire-to-Board
• 2–24 Circuit (Dual Row)
• 3–5 Circuits (Single Row)
• Up to 12A, 600V Rating
• Tin and Gold Plating
• Crimp Termination
• 16–28 AWG
• Through-hole, SMC and Press-fit